Samsung Debuts zHBM Prototype, Stacking Memory Directly on AI Accelerators
Samsung unveiled a prototype called zHBM that integrates high‑bandwidth memory directly onto artificial‑intelligence accelerator chips. By stacking the memory on the processor, the design aims to cut data‑transfer latency and lower power consumption compared with traditional separate memory modules. The company demonstrated the concept on a test board, suggesting potential future AI hardware improvements in the industry.